Ball Grid Array assembly with X-ray inspection
BGA (Ball Grid Array) assembly requires specialized equipment and expertise. Jichangsheng Technology has extensive experience in BGA assembly with pitch down to 0.4mm, including PBGA, CBGA, FBGA, and CSP packages.
All BGA assemblies are inspected using X-ray equipment to verify solder joint quality. We also provide BGA rework services for failed or misaligned BGAs.
Jichangsheng Technology is a leading PCB manufacturer in Shenzhen, China. We provide high-quality BGA Assembly with competitive pricing, quick turnaround, and excellent customer service. ISO 9001:2015 certified, RoHS compliant.